บทความวิจัยพ.ศ. 2557
Finite element analysis on the effect of solder joint geometry for the reliability of ball grid array assembly with flexible and rigid PCBS
Universiti Sains Malaysia พ.ศ. 2557
คำสำคัญ
Finite element simulationFlexible PCBBall grid array (BGA)Solder joint geometrySubmodeling analysis technique